Heat sink compound, non-silicone, non toxic, long-term stability

Type series MT8800

Heat sink compound, non-silicone, non toxic, long-term stability - MT8800

Features

  • Non-silicone product
  • Better heat transfer than silicone-based products
  • No solder bath contamination
  • Very low bleed and evaporation value
  • Compatible with metal and plastic components
  • Wide temperature range
  • Non toxic
  • Will not melt, dry or harden
  • Meets KS 21343 spec and Military Specificatio MIL-C-47113B

Options

  • See data sheet

Technical Data

Technische Daten
Consistency: 320 (Penetration, worked, 60x) per ASTM D-217
Specific gravit: 2,7 g /cm³ at 25 °C per ASTM D-70
Bleed: 0.1 %/Wt. at 200 °C/24h FTM-321 modifie
Evaporation: 0.6 %/Wt. at 200 °C/24h FTM-321 modifie
Thermal Conductivity at 36 °C: 0,70 W/m °K
16.7 x 10-4 Cal/sec cm °C
4.8 BTU.In (h/FT².°F)
"hot wire" method per MIL-C-47113B
Electrical properties: 305 V/mil dielectric strength 0.05" gap per ASTM D-149
4.50 dielectric constant, 25 °C at 1000 Hz per ADTM D-150
32 ppm/°C coefficient of thermal expansion
1.65 x 1014 Ohm/cm volume resistivity per ASTM D-257
Operating temperature range: -40...200 °C
Appearance: white paste
Type series
MT8800

Documents

Name
Description
EN
DE
  • T6-030

    Data Sheet

  • HE_127

    Manufacturer Declaration - China-RoHS

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